加熱製品
GB200 NVL72 Emulator
GB200 NVL72 Emulator consists of an OPC ORV3 Rack, 18 2U TTV load banks, 1 system control module, and a flow control module, enabling full rack thermal power simulation.
Features:
- Rack-level thermal load simulation with a maximum heat output of 120kW;
- TTV load bank is fully designed based on NVIDIA GB200 NVL72 Server; The control system can detect and record the temperature of each chip in real time;
- Equipped with flow regulation and display functions, allowing flexible flow setting based on testing requirements;
- Verified by NVIDIA.
Application:
- Simulating rack-level server heat generation, applicable for liquid-cooled CDU performance testing and verification;
- Performance testing of secondary-side liquid cooling systems in liquid-cooled data centers;
Technical parameters | Product Name | GB200 NVL72 Rack Emulator |
Model | SB-EMULATOR-3P/AC380-415V-60HZ | |
Input voltage | 3P AC380~415V 60Hz | |
Power interface | ME 560P6W-62335C,60 Amp 3P+N+G | |
Medium | PG-25, DI-water | |
Cooling circuit interface | FND25 1'' self-sealing interloacking ball valve | |
Design pressure | 10 bar (cooling loop) | |
Max TTV Power | 18x6.8=122kW | |
Control system & display screen | PLC & 4.3″ HMI | |
Control mode | Local mode & Remote mode Manual & Automatic | |
Communication protocol | MODBUS TCP/IP | |
Touchscreen display | Voltage, current, power, temperature, flow rate, alarm information, etc. | |
Protection | Over-temperature protection | |
Protection method | Cut off the TTV input power supply | |
Noise level | <60dB(A) | |
Working environment | -5~40℃,0~85%RH (No condensation) | |
Storage environment | -30°C~60°C,0~90%RH (No condensation) | |
Size (W*D*H) | 600mm*1068mm*2300 | |
Weight (kg) | 550kg |
製品情報